Hybrid package integration strategy for silicon ICs operating beyond 200 GHz

This paper proposes an innovative hybrid package integration strategy compatible with siliconbased technologies. It is evaluated beyond 200 GHz by the integration of a WR3 back-to-back waveguide-to-suspended stripline transition designed in BiCMOS technology, relying on metallic split-block package and organic laminate substrate. Simulated insertion loss below 3 dB is observed in the 220-320 GHz frequency band, competing with reported traditional solutions using III-V substrates. The achieved performances lead to promising perspectives for low-cost silicon packaging solutions beyond 200 GHz.