Published November 15, 2024
| Version v1
Journal article
Hybrid package integration strategy for silicon ICs operating beyond 200 GHz
Contributors
Others:
- STMicroelectronics [Crolles] (ST-CROLLES)
- Laboratoire de Polytech Nice-Sophia (Polytech'Lab) ; Université Nice Sophia Antipolis (1965 - 2019) (UNS)-Université Côte d'Azur (UniCA)
- Institut d'Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 (IEMN) ; Centrale Lille-Université de Lille-Centre National de la Recherche Scientifique (CNRS)-Université Polytechnique Hauts-de-France (UPHF)-JUNIA (JUNIA) ; Université catholique de Lille (UCL)-Université catholique de Lille (UCL)
- Photonique THz - IEMN (PHOTONIQUE THZ - IEMN) ; Institut d'Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 (IEMN) ; Centrale Lille-Université de Lille-Centre National de la Recherche Scientifique (CNRS)-Université Polytechnique Hauts-de-France (UPHF)-JUNIA (JUNIA) ; Université catholique de Lille (UCL)-Université catholique de Lille (UCL)-Centrale Lille-Université de Lille-Centre National de la Recherche Scientifique (CNRS)-Université Polytechnique Hauts-de-France (UPHF)-JUNIA (JUNIA) ; Université catholique de Lille (UCL)-Université catholique de Lille (UCL)
- Electronique pour Objets Connectés (EpOC) ; Université Nice Sophia Antipolis (1965 - 2019) (UNS)-Polytech Nice-Sophia-Université Côte d'Azur (UniCA)
- The authors acknowledge the host institutions thatsupported the work during the PhD of Dr Ovalle-Taylor: STMicroelectronics,Université Cote d'Azur (UCA), and the Centre National de la RechercheScientifique (CNRS).Funding statement. This work was carried out in the framework ofCIFRE contract (Convention number: 2020/1364), signed under three partners:STMicroelectronics Crolles, UCA, and CNRS.
- Laboratoire commun STMicroelectronics-IEMN T1
Description
This paper proposes an innovative hybrid package integration strategy compatible with siliconbased technologies. It is evaluated beyond 200 GHz by the integration of a WR3 back-to-back waveguide-to-suspended stripline transition designed in BiCMOS technology, relying on metallic split-block package and organic laminate substrate. Simulated insertion loss below 3 dB is observed in the 220-320 GHz frequency band, competing with reported traditional solutions using III-V substrates. The achieved performances lead to promising perspectives for low-cost silicon packaging solutions beyond 200 GHz.
Abstract
International audienceAdditional details
Identifiers
- URL
- https://hal.science/hal-04787620
- URN
- urn:oai:HAL:hal-04787620v1