Low pressure plasma treatment of CFRP substrates for adhesive bonding: an investigation of joint durability under severe temperature-moisture conditioning

Description

This work reports a quantitative evaluation of the aging behavior of adhesively bonded joints manufactured using a toughened epoxy adhesive applied on CFRP substrates. Low-pressure plasma (LPP) treatment was employed, adopting air and pure oxygen as process gases and varying working parameters such as power and exposure time. A preliminary testing campaign was performed under standard laboratory conditions to evaluate shear strength of single-lap joints (SLJ), comparing effectiveness of LPP treatments to a traditional mechanical abrasion of the adherends. Even at this early stage, experimental findings highlighted how this physical method provides for competitive performance over abrasion, resulting in a remarkable enhancement of the shear resistance. Four sets of LPP-treatment conditions were selected and then subjected to accelerated aging (consisting of 56 cycles of 5 h at T = 70 °C, RH>90% and 5 h at T = −40 °C each). Their behavior was compared to that of abraded joints, employed as a reference. To assess the durability of the CFRP-epoxy adhesive system under accelerated aging conditions, tensile shear strength (TSS) testing and wedge cleavage test (WT) were performed in parallel. The experimental results showed that low-pressure plasma treatment of the CFRP substrates results in increased short-term quality of the adhesive joint as well as in enhancement of its durability even under severe aging conditions.

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