A New Approach for AFM Cantilever Elaboration with 3C-SiC
- Others:
- GREMAN (matériaux, microélectronique, acoustique et nanotechnologies) (GREMAN - UMR 7347) ; Université de Tours (UT)-Institut National des Sciences Appliquées - Centre Val de Loire (INSA CVL) ; Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Centre National de la Recherche Scientifique (CNRS)
- Centre de recherche sur l'hétéroepitaxie et ses applications (CRHEA) ; Université Nice Sophia Antipolis (1965 - 2019) (UNS) ; COMUE Université Côte d'Azur (2015-2019) (COMUE UCA)-COMUE Université Côte d'Azur (2015-2019) (COMUE UCA)-Centre National de la Recherche Scientifique (CNRS)-Université Côte d'Azur (UCA)
- NOVASiC, Savoie Technolac ; NOVASiC, Savoie Technolac
Description
The recent achievement of a continuous silicon monocrystalline thin film on 3C-SiC epilayers deposited on silicon substrates has opened the field for new microstructures. In this work, this original hetero-structure is the basis for the elaboration of an entire cantilever for atomic force microscopy. The hetero-epitaxially grown silicon layer is used to define the tip of the cantilever fabricated from the 3C-SiC epilayer deposited on silicon. The complete cantilever is elaborated by plasma etching using a nickel mask. The use of a full dry etching process is very promising as it is independent of the crystalline orientation of the silicon epilayer contrary to process based on wet etching solutions. Moreover, based on such hetero-structure, new MEMS devices can be considered.
Abstract
International audience
Additional details
- URL
- https://hal.archives-ouvertes.fr/hal-01810915
- URN
- urn:oai:HAL:hal-01810915v1
- Origin repository
- UNICA