In this work, sub-micron-thick AlN/GaN transistors (HEMTs) grown on a silicon substrate for high-frequency power applications are reported. Using molecular beam epitaxy, an innovative ultrathin step-graded buffer with a total stack thickness of 450 nm enables one to combine an excellent electron confinement, as reflected by the low...
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July 6, 2023 (v1)Journal articleUploaded on: September 5, 2023
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2023 (v1)Journal article
We report on a sub-micron thick AlGaN/GaN high electron mobility transistor (HEMT) epilayers grown on silicon substrate with a state-of-the art vertical buffer breakdown field as high as 6 MV/cm enabling a high transistor breakdown voltage of 250 V for short gate to drain distances despite such a thin structure. HEMTs with a gate length of 100...
Uploaded on: March 25, 2023 -
November 12, 2023 (v1)Conference paper
ED11-2 (Oral)PRICE: BEST STUDENT AWARD
Uploaded on: January 19, 2024