GIANESELLO , Frédéric

In this paper, an innovative packaging integration strategy compatible with Silicon-based technologies is proposed. It is assessed beyond 200 GHz by the integration of a BiCMOS WR3 back-to-back waveguide (WG) to suspended stripline (SSL) transition in organic laminate substrate. An insertion loss below 3 dB is obtained in the 220-320 GHz band,...

This paper proposes an innovative hybrid package integration strategy compatible with siliconbased technologies. It is evaluated beyond 200 GHz by the integration of a WR3 back-to-back waveguide-to-suspended stripline transition designed in BiCMOS technology, relying on metallic split-block package and organic laminate substrate. Simulated...

In this letter, we present a method to extract the scattering parameters of a microelectronic probe used to feed on-chip or in-package antennas at millimeter-wave frequencies. It is especially important to take into account these losses in the calibration procedure necessary for the extraction of the antenna gain. We are specifically...

In this letter, we report the design, fabrication, and measurement of a silicon photonics-based transmitter (Tx) offering both mass production capability and high integration level potentiality. The Tx circuit consists of an integrated photodiode generating a 200-300-GHz signal for photonic upconversion from baseband to millimeter-wave. This Tx...

In this paper, we present a near-field pattern measurement based on an electro-optic sensing at 300 GHz band. The measurement system is based on a self-heterodyne technique and non-polarimetric frequency down-conversion technique. The far-field radiation pattern of a horn antenna calculated from the measured near-field pattern is compared with...

A substrate-integrated discrete-lens antenna manufactured in standard printed-circuit-board (PCB) technology is demonstrated in H-band (225-325 GHz). The arrays composed of phase-shifting unit cells and a waveguide-fed planar focal source are designed on a single PCB stack with five metal layers and multiple low-loss dielectric substrates in a...

In this Letter, the authors report the achievement of terahertz transmissions using advanced quadrature amplitude modulation (QAM)16 signals using 300 GHz silicon photonics devices, developed in industrial foundry process PIC25G. Up to 56 Gbps is obtained using QAM16 single channel modulation and up to 50 Gbps in a dual-channel configuration.

With the surge in mega-data communications, wireless networks are entering a revolution which has now taken off with 5G. From a user perspective, the main challenge is providing fast and agile connections in all usage scenarios. Considering the data-rates expected to be delivered to users (some urban areas with 1000 users per cell) the overall...

An innovative LDS 4G antenna solution operating in the 698-960 MHz band is presented. It is composed of two radiating elements recombined in a single feed broadband antenna system using a diplexer. This circuit is realized thanks to lumped components, assembled directly on the plastic piece which supports the antenna. Corresponding measurements...

An innovative LDS 4G antenna solution operating in the 698-960 MHz band is presented. It is composed of two radiating elements recombined in a single feed broadband antenna system using a diplexer. This circuit is realized thanks to lumped components, assembled directly on the plastic piece which supports the antenna. Corresponding measurements...

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In this paper, we present a new wideband miniature branchline coupler as a key circuit to be integrated in 60-GHz packaged beamforming networks for phased-array antennas. First, the integrated passive device (IPD) technology from STMicroelectronics is investigated in the mm-wave range through the simulation, fabrication, and measurements of a...

This paper presents the use of a Yagi-Uda antenna on polymer substrate for 300 GHz data communications. The antenna is described and characterized in terms of radiation pattern in the 300 GHz band. Then, it is used and validated within a communication link. Using amplitude shift keying modulation at 10 Gbps and without any signal...

In this paper, an innovative 4G antenna solution operating in the 698-960 MHz band, is presented. It is composed of two radiating elements recombined in a single feed antenna-system using an integrated power divider/combiner, synthesized thanks to five lumped components. Simulations using realistic SMD (Surface Mount Devices) components allow...

The integration of a Vivaldi antenna on a printed circuit board (PCB) targeting 60-GHz WiGig applications is presented in this letter. The integrated passive device (IPD)technology from STMicroelectronics based on a glass substrate is used for the antenna manufacturing. In free space, the radiation pattern measurements show a realized gain...

We report on the use of a Yagi-Uda antenna on polymer substrate used in a 306 GHz-20 Gbit/s real-time data link for indoor applications. The Yagi-Uda antenna is described and the validation of the THz link is obtained in amplitude modulation mode and using QAM-16 signals (32 Gbit/s).

In this paper, we propose an assessment up to 325 GHz of Micro Laser Sintering (MLS) metal 3D-Printing technology in order to achieve lightweight and cost-effective millimeter wave (mmW) passive function. We first designed and manufactured a bended WR5 waveguide in order to assess achievable roughness and insertion loss. In a second step, an...

This article presents a portable system for freehand antenna diagnosis and characterization based on amplitude-only data. The amplitude-only samples are acquired by moving a handheld probe, which is tracked by a motion capture system, in front of the antenna under test (AUT) aperture. The acquired measurements are processed using the phaseless...