GIANESELLO , Frédéric

In this paper, an innovative packaging integration strategy compatible with Silicon-based technologies is proposed. It is assessed beyond 200 GHz by the integration of a BiCMOS WR3 back-to-back waveguide (WG) to suspended stripline (SSL) transition in organic laminate substrate. An insertion loss below 3 dB is obtained in the 220-320 GHz band,...

This paper proposes an innovative hybrid package integration strategy compatible with siliconbased technologies. It is evaluated beyond 200 GHz by the integration of a WR3 back-to-back waveguide-to-suspended stripline transition designed in BiCMOS technology, relying on metallic split-block package and organic laminate substrate. Simulated...

In this letter, we present a method to extract the scattering parameters of a microelectronic probe used to feed on-chip or in-package antennas at millimeter-wave frequencies. It is especially important to take into account these losses in the calibration procedure necessary for the extraction of the antenna gain. We are specifically...